Thermal Solution

Thermal design, cooling methods and criterion equation of electronic equipment

The thermal design of electronic products aims to control the temperature of electronic components in an appropriate and reliable
way, so that electronic equipment can operate steadily in the working environment. To ensure reliable thermal dissipation,
the temperature shall be strictly controlled below the specified maximum temperature. Moreover, the thermal design of
electronic equipment shall be conducted simultaneously with circuit design and structural design to take all factors into account.
Specifically, the cooling methods for thermal design of electronic equipment shall be designed with the following factors in
mind: 1. Technical requirements for thermal design of product; 2. Thermal dissipation power of components; 3. The working
environment of electronic equipment; and 4. Volume and surface area.
The common cooling methods for thermal design of electronic equipment include:
1. Free cooling (including heat conduction, free convection, radiation heat transfer)
2. Forced cooling (including forced air cooling, forced mixed liquid cooling)
3. TEC thermoelectric cooling
4. Heat pipe radiator
The cooling method is generally select  according to heat flow cryptography and temperature rise requirements of equipment.
Below is a reference diagram for cooling methods.



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Renxin. Seiko offers detailed thermal analysis and validation services using powerful Computational Fluid Dynamics (CFD) and proprietary simulation packages. With this effective modeling technology, our on-site thermal design engineers can asses your designs throughout the development cycle - at Component, Board and System levels. By directly loading your CAD files(STP,IGS.DWG) into our CFD package, we can conduct the analyses you need and deliver results within a short time frame.Thermal CFD Analysis is based on state-of-the-art thermal simulation modeling, fluid mechanics, and finite element analysis, our state-of-the-art design simulation system allows you to approximate a heatsink design to match your specific requirements - often within 24 hours. The system can promptly forecast thermal performance for given heatsink design with varying air speeds - and even determine the optimum number of pin rows and columns for your individual performance specifications. Within moments, we can help establish the fin style and pattern necessary to maximize performance and minimize air pressure loss. Our  simulations are generally within ±5% percent of the actual test. High performance heatsinks are manufactured by a variety of different  processes such as die casting, micro forging, extrusion, investment casting, and machining. Knowing the manufacturing strengths of each process and the thermal conductivity of the metals used by each, Renxin.Thermal Thchnology's design system can also be used to predict the most cost-effective processes for your application. In addition, Our engineers can work with you to select the approach that best fits your cost and performance ratio.